Semiconductor Environmental Reliability Testing

November 4, 2021

Latest company news about Semiconductor Environmental Reliability Testing

Semiconductor devices are very sensitive to impurities and dust. Therefore, it is very necessary to accurately control the level of impurities and dust in the complicated production process. The quality of the final product is sufficient for each relatively independent and interactive production stage in the production, such as metallization, chip material, packaging, etc.

Due to the rapid advancement of technology, new materials and new processes are constantly being used in newly developed devices, and the market continues to put forward demanding requirements for design time, so it is basically impossible to perform reliability design according to existing products. In order to achieve certain economic indicators, semiconductor products are always produced in large quantities; and it is impractical to repair semiconductor products. Therefore, it has become a very necessary requirement for semiconductor products to add the concept of reliability in the design stage and reduce variables in the production stage.

The reliability of semiconductor devices depends on assembly, use, and environmental conditions. Influencing factors include gas, dust, contamination, voltage, current density, temperature, humidity, stress, reciprocating vibration, severe vibration, pressure and electromagnetic field strength.

latest company news about Semiconductor Environmental Reliability Testing  0


Semiconductor Environmental Reliability Testing
Temperature and humidity bias cycle test
■ Steady-state damp heat bias life test
Highly accelerated cooking test
■ High temperature storage life test
■ Temperature cycle test
■ Power-on temperature cycle test
■ Temperature shock test
Salt spray test
■ Temperature bias working life test
■ Highly accelerated life test
■ Highly accelerated life test without bias
■ Vibration and sweep frequency test