The Difference Between Thermal Shock Chamber and Rapid Temperature Testing Machine
January 5, 2022
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| project | Thermal Shock Chamber | Rapid temperature change | remarks |
| Experimental purpose | Thermal Shock Chamber is mainly used to examine the chemical change or physical damage of the sample caused by thermal expansion and cold contraction (CTE see note #1) after the temperature of the sample changes rapidly for a certain number of times | Using the external environmental stress, the potential exists in the R & D, design and production process of electronic products, which is affected by traceless components, manufacturing technology and other reasonsThe early faults caused are exposed early, which shall be corrected and corrected | The purpose of the experiment is different |
| Test phase | Mainly in the R & D and design stage | Mainly in mass production stage | The test phase is different |
| Temperature change rate requirements | There is no temperature change rate index, but temperature 1 is required. In order to enhance the screening effect, the recovery time of common rapid temperature change box is generally the reference point at air outlet 1. It is recommended to select the temperature change rate of 10-25 ℃ / min, mouth. Domestic and foreign standards require 5min to 1 and the temperature change rate is controllable;Inside, the faster the better;There are also standard requirements for measuring on the product surface, and the temperature recovery time is within 15min | In order to enhance the screening effect, it is recommended that the temperature change rate of common rapid temperature change boxes is 10-25 ℃ / min, and the temperature change rate is controllable; |